1N4746CURTR vs MX1N3026CUR-1E3TR feature comparison

1N4746CURTR Microsemi Corporation

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MX1N3026CUR-1E3TR Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-213AB
Package Description HERMETIC SEALED, GLASS, MELF-2 O-LELF-R2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature TR, 7 INCH; 1500 METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 20 Ω
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 18 V 18 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 14 mA 14 mA
Base Number Matches 1 1
Operating Temperature-Min -65 °C

Compare 1N4746CURTR with alternatives

Compare MX1N3026CUR-1E3TR with alternatives