1N4733ARL2
vs
1N4733AP/TR8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
MICROSEMI CORP
Package Description
O-LALF-W2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
Knee Impedance-Max
550 Ω
Number of Elements
1
Number of Terminals
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
1 W
Qualification Status
Not Qualified
Reference Voltage-Nom
5.1 V
Reverse Current-Max
10 µA
Surface Mount
NO
Technology
ZENER
Terminal Form
WIRE
Terminal Position
AXIAL
Voltage Tol-Max
5%
Working Test Current
49 mA
Base Number Matches
4
2
Rohs Code
No
Samacsys Manufacturer
Microsemi Corporation