1N4683CE3TR vs 1N4683C feature comparison

1N4683CE3TR Microsemi Corporation

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1N4683C Tak Cheong Electronics (Holdings) Co Ltd

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Package Description O-LALF-W2 O-LALF-W2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 3 V 3 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 0.05 mA 0.05 mA
Base Number Matches 1 15
Pbfree Code Yes
Rohs Code Yes
Part Package Code DO-204
Pin Count 2
Manufacturer Package Code CASE 299
Additional Feature METALLURGICALLY BONDED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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