1N4627D
vs
JANHCA1N4627
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
COBHAM PLC
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
DIE-2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-35
|
|
JESD-30 Code |
O-LALF-W2
|
S-XXUC-N2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
6.2 V
|
6.2 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UNSPECIFIED
|
Voltage Tol-Max |
1%
|
5%
|
Working Test Current |
0.25 mA
|
0.25 mA
|
Base Number Matches |
15
|
3
|
Rohs Code |
|
No
|
Part Package Code |
|
DIE
|
Pin Count |
|
2
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Reference Standard |
|
MIL-19500/435F
|
|
|
|
Compare 1N4627D with alternatives
Compare JANHCA1N4627 with alternatives