1N459A
vs
1N459T26A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-PALF-W2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1 V
1 V
JEDEC-95 Code
DO-7
DO-35
JESD-30 Code
O-LALF-W2
O-PALF-W2
JESD-609 Code
e0
Non-rep Pk Forward Current-Max
1.5 A
Number of Elements
1
1
Number of Phases
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Output Current-Max
0.04 A
0.2 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
200 V
200 V
Surface Mount
NO
NO
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
15
2
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