1N4575 vs CH4575-37-WAFFLE feature comparison

1N4575 STMicroelectronics

Buy Now Datasheet

CH4575-37-WAFFLE Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MICROSEMI CORP
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature TEMPERATURE COMPENSATED
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 50 Ω
JESD-30 Code O-LALF-W2 X-XUUC-N
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND UNSPECIFIED
Package Style LONG FORM UNCASED CHIP
Power Dissipation-Max 0.4 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.4 V 6.4 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UPPER
Voltage Temp Coeff-Max 0.64 mV/°C 0.64 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 2 mA 2 mA
Base Number Matches 17 1
Package Description X-XUUC-N
Polarity UNIDIRECTIONAL

Compare 1N4575 with alternatives

Compare CH4575-37-WAFFLE with alternatives