1N4575
vs
CH4575-37-WAFFLE
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
MICROSEMI CORP
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
TEMPERATURE COMPENSATED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
50 Ω
JESD-30 Code
O-LALF-W2
X-XUUC-N
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
UNSPECIFIED
Package Style
LONG FORM
UNCASED CHIP
Power Dissipation-Max
0.4 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.4 V
6.4 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UPPER
Voltage Temp Coeff-Max
0.64 mV/°C
0.64 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
2 mA
2 mA
Base Number Matches
17
1
Package Description
X-XUUC-N
Polarity
UNIDIRECTIONAL
Compare 1N4575 with alternatives
Compare CH4575-37-WAFFLE with alternatives