1N4569A vs JANKCA1N4569A feature comparison

1N4569A Motorola Mobility LLC

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JANKCA1N4569A Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Package Description O-LALF-W2 HERMETIC SEALED, DIE-3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature HIGH RELIABILITY
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 200 Ω
JEDEC-95 Code DO-204AH
JESD-30 Code O-LALF-W2 S-XUUC-N3
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 3
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM UNCASED CHIP
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.4 V 6.4 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UPPER
Voltage Temp Coeff-Max 0.032 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 0.5 mA
Base Number Matches 4 1
Part Package Code DIE
Pin Count 3
Reference Standard MIL-19500/452G

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