1N4568
vs
1N4568E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MICROSEMI CORP
Package Description
O-LALF-W2
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code
unknown
compliant
Additional Feature
HIGH RELIABILITY
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
200 Ω
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Dissipation-Max
0.4 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
6.4 V
6.4 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Temp Coeff-Max
0.064 mV/°C
0.06 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
0.5 mA
Base Number Matches
17
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare 1N4568E3 with alternatives