1N4566AE3
vs
1N4566A
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
INVENSYS SENSOR SYSTEMS
|
Package Description |
HERMETIC SEALED, GLASS, DO-35, 2 PIN
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-204AH
|
|
JESD-30 Code |
O-LALF-W2
|
|
JESD-609 Code |
e3
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Power Dissipation-Max |
0.5 W
|
0.4 W
|
Reference Voltage-Nom |
6.4 V
|
6.4 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WIRE
|
|
Terminal Position |
AXIAL
|
|
Voltage Temp Coeff-Max |
0.32 mV/°C
|
|
Voltage Tol-Max |
5%
|
5%
|
Base Number Matches |
2
|
19
|
Dynamic Impedance-Max |
|
200 Ω
|
Operating Temperature-Max |
|
175 °C
|
Working Test Current |
|
0.5 mA
|
|
|
|
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