1N4563BE3
vs
1N3305RB
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TO-3
|
|
| Package Description |
O-MBFM-P2
|
HERMETIC SEALED, METAL, DO-5, 1 PIN
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ANODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
0.16 Ω
|
0.2 Ω
|
| JEDEC-95 Code |
TO-204AD
|
DO-203AB
|
| JESD-30 Code |
O-MBFM-P2
|
O-MUPM-D1
|
| JESD-609 Code |
e3
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
POST/STUD MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Reference Voltage-Nom |
6.8 V
|
6.8 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
SOLDER LUG
|
| Terminal Position |
BOTTOM
|
UPPER
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
1850 mA
|
1850 mA
|
| Base Number Matches |
1
|
4
|
| Factory Lead Time |
|
35 Weeks
|
| Additional Feature |
|
LOW IMPEDANCE
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1N4563BE3 with alternatives
Compare 1N3305RB with alternatives