1N4555AE3
vs
1N4555R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-MUPM-D1
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
PD-CASE
PD-CASE
Case Connection
ANODE
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-203AB
DO-203AB
JESD-30 Code
O-MUPM-D1
O-MUPM-D1
Number of Elements
1
1
Number of Terminals
1
1
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
POST/STUD MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
50 W
50 W
Reference Voltage-Nom
6.8 V
6.8 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
SOLDER LUG
SOLDER LUG
Terminal Position
UPPER
UPPER
Voltage Tol-Max
10%
20%
Working Test Current
1850 mA
1850 mA
Base Number Matches
1
8
Rohs Code
Dynamic Impedance-Max
0.16 Ω
Knee Impedance-Max
200 Ω
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Reverse Current-Max
10 µA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Temp Coeff-Max
3.604 mV/°C
Compare 1N4555AE3 with alternatives
Compare 1N4555R with alternatives