1N4486
vs
JAN1N4486C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
28 Weeks
28 Weeks
kg CO2e/kg
8.7
Average Weight (mg)
283
CO2e (mg)
2462.1
Category CO2 Kg
8.7
Compliance Temperature Grade
Military: -65C to +175C
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Additional Feature
METALLURGICALLY BONDED
HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Reference Voltage-Nom
3.6 V
75 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
2%
Working Test Current
69 mA
3.3 mA
Base Number Matches
30
2
Qualification Status
Qualified
Reference Standard
MIL-19500
Compare 1N4486 with alternatives
Compare JAN1N4486C with alternatives