1N4485TR
vs
1N6485
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-PALF-W2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
HIGH PERFORMANCE
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
68 V
3.3 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
3
28
Factory Lead Time
28 Weeks
Category CO2 Kg
8.7
Compliance Temperature Grade
Military: -65C to +175C
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Voltage Tol-Max
5%
Working Test Current
76 mA
Compare 1N4485TR with alternatives
Compare 1N6485 with alternatives