1N4484USE3 vs JAN1N4484 feature comparison

1N4484USE3 Microsemi Corporation

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JAN1N4484 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 80 Ω
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 1.5 W 1.5 W
Reference Voltage-Nom 62 V 62 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish PURE MATTE TIN TIN LEAD
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 4 mA 4 mA
Base Number Matches 1 9
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection ISOLATED
JEDEC-95 Code DO-41
JESD-609 Code e0
Operating Temperature-Min -65 °C
Polarity UNIDIRECTIONAL
Qualification Status Not Qualified
Reference Standard MIL-19500

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