1N4481D
vs
JAN1N4481
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SEMTECH CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, G99, 2 PIN
Reach Compliance Code
compliant
unknown
Factory Lead Time
52 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
O-XALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Reference Voltage-Nom
47 V
47 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
1%
4.89%
Working Test Current
5.5 mA
5.5 mA
Base Number Matches
9
2
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
50 Ω
Qualification Status
Qualified
Reference Standard
MIL-19500/406
Compare 1N4481D with alternatives
Compare JAN1N4481 with alternatives