1N4476US vs 1N4476DE3 feature comparison

1N4476US Microchip Technology Inc

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1N4476DE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
Factory Lead Time 28 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Reference Voltage-Nom 30 V 30 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 5% 1%
Working Test Current 8.5 mA 8.5 mA
Base Number Matches 6 1
Package Description O-LALF-W2
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 20 Ω
JEDEC-95 Code DO-41
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C

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