1N4476US
vs
1N4476DE3
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
compliant
Factory Lead Time
28 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Reference Voltage-Nom
30 V
30 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Voltage Tol-Max
5%
1%
Working Test Current
8.5 mA
8.5 mA
Base Number Matches
6
1
Package Description
O-LALF-W2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
20 Ω
JEDEC-95 Code
DO-41
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare 1N4476US with alternatives
Compare 1N4476DE3 with alternatives