1N4468
vs
1SMA5928BT3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MOTOROLA INC
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
R-PDSO-C2
Reach Compliance Code
unknown
unknown
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
R-PDSO-C2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
0.9 W
Reference Voltage-Nom
13 V
13 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
C BEND
Terminal Position
AXIAL
DUAL
Voltage Tol-Max
5%
5%
Working Test Current
19 mA
28.8 mA
Base Number Matches
12
4
Pin Count
2
Manufacturer Package Code
CASE 403B-01
ECCN Code
EAR99
HTS Code
8541.10.00.50
Knee Impedance-Max
550 Ω
Qualification Status
Not Qualified
Reverse Current-Max
0.5 µA
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