1N4448WS-FL
vs
DL4448-TP
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
FORMOSA MICROSEMI CO LTD
|
MICRO COMMERCIAL COMPONENTS
|
| Package Description |
R-PDSO-F2
|
MINIMELF-2
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-F2
|
O-LELF-R2
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
200 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.15 A
|
0.15 A
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Power Dissipation-Max |
0.2 W
|
0.5 W
|
| Rep Pk Reverse Voltage-Max |
75 V
|
100 V
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
FLAT
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
MELF
|
| Pin Count |
|
2
|
| Samacsys Manufacturer |
|
MCC
|
| Additional Feature |
|
METALLURGICAL BONDED
|
| Case Connection |
|
ISOLATED
|
| Forward Voltage-Max (VF) |
|
1 V
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
0.5 A
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
5 µA
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare 1N4448WS-FL with alternatives
Compare DL4448-TP with alternatives