1N4148UB2R
vs
1N4148UR-1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
35 Weeks
|
|
| Application |
GENERAL PURPOSE
|
SWITCHING
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.8 V
|
1.2 V
|
| JESD-609 Code |
e4
|
|
| Non-rep Pk Forward Current-Max |
2 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Rep Pk Reverse Voltage-Max |
75 V
|
75 V
|
| Reverse Recovery Time-Max |
0.005 µs
|
0.005 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Gold (Au) - with Nickel (Ni) barrier
|
|
| Base Number Matches |
2
|
9
|
| Package Description |
|
MELF-2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Breakdown Voltage-Min |
|
100 V
|
| JEDEC-95 Code |
|
DO-213AA
|
| JESD-30 Code |
|
O-LELF-R2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
MIL-19500
|
| Reverse Current-Max |
|
0.5 µA
|
| Reverse Test Voltage |
|
75 V
|
| Terminal Form |
|
WRAP AROUND
|
| Terminal Position |
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 1N4148UB2R with alternatives
Compare 1N4148UR-1 with alternatives