1N4123D-1
vs
JAN1N4123D
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Package Description |
HERMETIC SEALED, GLASS, DO-35, 2 PIN
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
200 Ω
|
|
JEDEC-95 Code |
DO-204AH
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.48 W
|
0.5 W
|
Reference Voltage-Nom |
39 V
|
39 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Tol-Max |
1%
|
1%
|
Working Test Current |
0.25 mA
|
0.25 mA
|
Base Number Matches |
14
|
3
|
Qualification Status |
|
Not Qualified
|
Reference Standard |
|
MIL-19500/435
|
|
|
|
Compare 1N4123D-1 with alternatives
Compare JAN1N4123D with alternatives