1N4104-AP
vs
1N4104-1E3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS
MICROSEMI CORP
Part Package Code
DO-35
DO-35
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
10 V
10 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
10
Voltage Tol-Max
5%
5%
Working Test Current
0.25 mA
0.25 mA
Base Number Matches
1
1
Dynamic Impedance-Max
200 Ω
Operating Temperature-Min
-65 °C
Compare 1N4104-AP with alternatives
Compare 1N4104-1E3 with alternatives