1N4101UR
vs
1N4101URE3TR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, MLL34, MELF-2
O-LELF-R2
Reach Compliance Code
compliant
compliant
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
TR, 7 INCH: 2000
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
200 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
8.2 V
8.2 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
0.25 mA
0.25 mA
Base Number Matches
8
1
Pbfree Code
Part Package Code
DO-213AA
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Operating Temperature-Min
-65 °C
Compare 1N4101UR with alternatives
Compare 1N4101URE3TR-1 with alternatives