1N3827DE3 vs MQ1N4734DPTR feature comparison

1N3827DE3 Microsemi Corporation

Buy Now Datasheet

MQ1N4734DPTR Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LALF-W2 O-PALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-LALF-W2 O-PALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Reference Voltage-Nom 5.6 V 5.6 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 1% 1%
Working Test Current 45 mA 45 mA
Base Number Matches 1 1
Rohs Code No
Part Package Code DO-41
Pin Count 2
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Qualification Status Not Qualified
Terminal Finish TIN LEAD

Compare 1N3827DE3 with alternatives

Compare MQ1N4734DPTR with alternatives