1N3827DE3 vs 1N3827D-B feature comparison

1N3827DE3 Microsemi Corporation

Buy Now Datasheet

1N3827D-B Micro Commercial Components

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICRO COMMERCIAL COMPONENTS
Package Description O-LALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JEDEC-95 Code DO-41
JESD-30 Code O-LALF-W2
Number of Elements 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 1 W
Reference Voltage-Nom 5.6 V
Surface Mount NO
Technology ZENER
Terminal Form WIRE
Terminal Position AXIAL
Voltage Tol-Max 1%
Working Test Current 45 mA
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

Compare 1N3827DE3 with alternatives

Compare 1N3827D-B with alternatives