1N3823A
vs
BZV85-C3V9,133
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
NXP SEMICONDUCTORS
Part Package Code
DO-13
DO-4
Package Description
HERMETIC SEALED, METAL GLASS, DO-13, 2 PIN
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-202AA
DO-41
JESD-30 Code
O-MALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Knee Impedance-Max
400 Ω
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
METAL
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Reference Voltage-Nom
3.9 V
3.9 V
Reverse Current-Max
50 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
Voltage Tol-Max
5%
5%
Working Test Current
64 mA
60 mA
Base Number Matches
10
2
Manufacturer Package Code
SOD66
Factory Lead Time
4 Weeks
Dynamic Impedance-Max
15 Ω
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare 1N3823A with alternatives
Compare BZV85-C3V9,133 with alternatives