1N3823A vs BZV85-C3V9,133 feature comparison

1N3823A Microsemi Corporation

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BZV85-C3V9,133 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Part Package Code DO-13 DO-4
Package Description HERMETIC SEALED, METAL GLASS, DO-13, 2 PIN ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-202AA DO-41
JESD-30 Code O-MALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Knee Impedance-Max 400 Ω
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material METAL GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified
Reference Voltage-Nom 3.9 V 3.9 V
Reverse Current-Max 50 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 5%
Working Test Current 64 mA 60 mA
Base Number Matches 10 2
Manufacturer Package Code SOD66
Factory Lead Time 4 Weeks
Dynamic Impedance-Max 15 Ω
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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