1N3779
vs
RH821-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INVENSYS SENSOR SYSTEMS
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
10 Ω
|
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
200 °C
|
|
| Power Dissipation-Max |
0.4 W
|
0.5 W
|
| Reference Voltage-Nom |
6.5 V
|
6.2 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Voltage Tol-Max |
3%
|
5%
|
| Working Test Current |
7.5 mA
|
|
| Base Number Matches |
6
|
1
|
| Part Package Code |
|
DO-204
|
| Package Description |
|
O-LALF-W2
|
| Pin Count |
|
2
|
| Additional Feature |
|
RADIATION HARDENED
|
| Case Connection |
|
ISOLATED
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-7
|
| JESD-30 Code |
|
O-LALF-W2
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
ZENER
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
| Voltage Temp Coeff-Max |
|
0.62 mV/°C
|
|
|
|
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