1N3779 vs 1N821A153 feature comparison

1N3779 Microsemi Corporation

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1N821A153 NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Part Package Code DO-7
Package Description O-XALF-W2 O-LALF-W2
Pin Count 2
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Samacsys Manufacturer Microsemi Corporation
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-7 DO-34
JESD-30 Code O-XALF-W2 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.4 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.7 V 6.2 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 1.005 mV/°C 0.62 mV/°C
Voltage Tol-Max 5%
Base Number Matches 2 1
Operating Temperature-Max 200 °C
Working Test Current 7.5 mA

Compare 1N3779 with alternatives

Compare 1N821A153 with alternatives