1N3685B
vs
BZV85-C18,133
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
21 Ω
20 Ω
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Reference Voltage-Nom
18 V
18 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
7 mA
15 mA
Base Number Matches
1
2
Part Package Code
DO-4
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Manufacturer Package Code
SOD66
Factory Lead Time
4 Weeks
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare 1N3685B with alternatives
Compare BZV85-C18,133 with alternatives