1N3600
vs
JAN1N3600
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-7
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
SIMILAR TO DO-7, 2 PIN
Pin Count
2
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.70
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1 V
1 V
JEDEC-95 Code
DO-7
DO-7
JESD-30 Code
O-LALF-W2
O-XALF-W2
JESD-609 Code
e0
e0
Non-rep Pk Forward Current-Max
4 A
4 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
0.2 A
0.2 A
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Rep Pk Reverse Voltage-Max
50 V
50 V
Reverse Current-Max
0.1 µA
0.1 µA
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
NO
NO
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
9
1
Category CO2 Kg
8.8
Compliance Temperature Grade
Military: -65C to +175C
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Qualifications
DLA
Application
GENERAL PURPOSE
Reference Standard
MIL-19500/231H
Compare 1N3600 with alternatives
Compare JAN1N3600 with alternatives