1N3595US
vs
MUR170E
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.70
|
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
1.7 V
|
| JESD-30 Code |
O-LELF-R2
|
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Pk Forward Current-Max |
4 A
|
35 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
0.2 A
|
1 A
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Qualification Status |
Not Qualified
|
|
| Reverse Current-Max |
0.001 µA
|
|
| Reverse Recovery Time-Max |
3 µs
|
0.075 µs
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Base Number Matches |
4
|
4
|
| Rep Pk Reverse Voltage-Max |
|
700 V
|
|
|
|
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