1N3337 vs JANTX1N3337C feature comparison

1N3337 Microchip Technology Inc

Buy Now Datasheet

JANTX1N3337C Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN O-MUPM-D1
Reach Compliance Code compliant compliant
Additional Feature PD-CASE PD-CASE
Case Connection ANODE ANODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 9 Ω
JEDEC-95 Code DO-203AB DO-203AB
JESD-30 Code O-MUPM-D1 O-MUPM-D1
Knee Impedance-Max 150 Ω
Number of Elements 1 1
Number of Terminals 1 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 75 V 75 V
Reverse Current-Max 10 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Temp Coeff-Max 67.5 mV/°C
Voltage Tol-Max 20% 2%
Working Test Current 170 mA 170 mA
Base Number Matches 17 1
Part Package Code DO-5
Pin Count 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Reference Standard MIL-19500

Compare 1N3337 with alternatives

Compare JANTX1N3337C with alternatives