1N3337
vs
1N3337E3
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
|
O-MUPM-D1
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
PD-CASE
|
PD-CASE
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
9 Ω
|
|
| JEDEC-95 Code |
DO-203AB
|
DO-203AB
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Knee Impedance-Max |
150 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
75 V
|
75 V
|
| Reverse Current-Max |
10 µA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Temp Coeff-Max |
67.5 mV/°C
|
|
| Voltage Tol-Max |
20%
|
20%
|
| Working Test Current |
170 mA
|
170 mA
|
| Base Number Matches |
17
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
|
|
|
Compare 1N3337 with alternatives
Compare 1N3337E3 with alternatives