1N3335B
vs
JAN1N3335B
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NEW ENGLAND SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, DO-5, 1 PIN
|
DO-5, 1 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
7 Ω
|
|
| JEDEC-95 Code |
DO-5
|
DO-5
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Knee Impedance-Max |
120 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Voltage-Nom |
62 V
|
62 V
|
| Reverse Current-Max |
5 µA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Voltage Temp Coeff-Max |
55.8 mV/°C
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
200 mA
|
200 mA
|
| Base Number Matches |
14
|
5
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Reference Standard |
|
MIL-19500/358E
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare JAN1N3335B with alternatives