1N3329
vs
1N3329
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SEMICON COMPONENTS INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
4.5 Ω
|
4.5 Ω
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Reference Voltage-Nom |
45 V
|
45 V
|
| Surface Mount |
NO
|
NO
|
| Voltage Tol-Max |
20%
|
20%
|
| Working Test Current |
280 mA
|
280 mA
|
| Base Number Matches |
6
|
40
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DO-5
|
| Package Description |
|
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
|
| Pin Count |
|
1
|
| Additional Feature |
|
PD-CASE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-203AB
|
| JESD-30 Code |
|
O-MUPM-D1
|
| Knee Impedance-Max |
|
100 Ω
|
| Number of Terminals |
|
1
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
POST/STUD MOUNT
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
10 µA
|
| Technology |
|
ZENER
|
| Terminal Form |
|
SOLDER LUG
|
| Terminal Position |
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Voltage Temp Coeff-Max |
|
40.5 mV/°C
|
|
|
|