1N3324RB
vs
JAN1N3324B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, METAL, DO-5, 1 PIN
|
DO-5, 1 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
35 Weeks
|
35 Weeks
|
| Additional Feature |
LOW IMPEDANCE
|
|
| Case Connection |
CATHODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
3 Ω
|
|
| JEDEC-95 Code |
DO-203AB
|
DO-5
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Voltage-Nom |
30 V
|
30 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
420 mA
|
420 mA
|
| Base Number Matches |
4
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Reference Standard |
|
MIL-19500/358E
|
|
|
|
Compare 1N3324RB with alternatives
Compare JAN1N3324B with alternatives