1N3312
vs
1N3312RB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-5
Package Description
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
HERMETIC SEALED, METAL, DO-5, 1 PIN
Pin Count
1
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
PD-CASE
LOW IMPEDANCE
Case Connection
ANODE
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
1.1 Ω
JEDEC-95 Code
DO-203AB
DO-203AB
JESD-30 Code
O-MUPM-D1
O-MUPM-D1
Knee Impedance-Max
80 Ω
Number of Elements
1
1
Number of Terminals
1
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
POST/STUD MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
50 W
50 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
13 V
13 V
Reverse Current-Max
10 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
SOLDER LUG
SOLDER LUG
Terminal Position
UPPER
UPPER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Temp Coeff-Max
8.45 mV/°C
Voltage Tol-Max
20%
5%
Working Test Current
960 mA
960 mA
Base Number Matches
64
4
Factory Lead Time
35 Weeks
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 1N3312 with alternatives
Compare 1N3312RB with alternatives