1N3312
vs
1N2811
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MOTOROLA INC
Package Description
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
O-MBFM-P2
Reach Compliance Code
compliant
unknown
Additional Feature
PD-CASE
Case Connection
ANODE
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
1.1 Ω
1.1 Ω
JEDEC-95 Code
DO-203AB
JESD-30 Code
O-MUPM-D1
O-MBFM-P2
Knee Impedance-Max
80 Ω
80 Ω
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
50 W
50 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
13 V
13 V
Reverse Current-Max
10 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
SOLDER LUG
PIN/PEG
Terminal Position
UPPER
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Temp Coeff-Max
8.45 mV/°C
8.45 mV/°C
Voltage Tol-Max
20%
20%
Working Test Current
960 mA
960 mA
Base Number Matches
13
12
ECCN Code
EAR99
HTS Code
8541.10.00.50
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 1N3312 with alternatives
Compare 1N2811 with alternatives