1N3309AE3
vs
1N3310B
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
NEW JERSEY SEMICONDUCTOR PRODUCTS INC
|
| Package Description |
O-MUPM-D1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
PD-CASE
|
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-203AB
|
|
| JESD-30 Code |
O-MUPM-D1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
METAL
|
|
| Package Shape |
ROUND
|
|
| Package Style |
POST/STUD MOUNT
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Reference Voltage-Nom |
10 V
|
11 V
|
| Surface Mount |
NO
|
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
SOLDER LUG
|
|
| Terminal Position |
UPPER
|
|
| Voltage Tol-Max |
10%
|
5%
|
| Working Test Current |
1200 mA
|
3900 mA
|
| Base Number Matches |
1
|
14
|
|
|
|
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