1N3166 vs 1N1187 feature comparison

1N3166 Microsemi Corporation

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1N1187 STMicroelectronics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP STMICROELECTRONICS
Part Package Code DO-9
Package Description METAL, DO-9, 1 PIN
Pin Count 1
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Application POWER GENERAL PURPOSE
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.95 V 1.5 V
JEDEC-95 Code DO-205AB
JESD-30 Code O-MUPM-H1 O-MUPM-D1
JESD-609 Code e0
Non-rep Pk Forward Current-Max 3000 A 700 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 1 1
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C -55 °C
Output Current-Max 240 A 40 A
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 300 V 300 V
Reverse Recovery Time-Max 5 µs
Surface Mount NO NO
Terminal Finish TIN LEAD
Terminal Form HIGH CURRENT CABLE SOLDER LUG
Terminal Position UPPER UPPER
Base Number Matches 4 2
Additional Feature LEAKAGE CURRENT IS NOT AT 25 DEG C
Power Dissipation-Max 44 W
Reverse Current-Max 500 µA

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