1N3154A
vs
1N3154-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETICALLY SEALED, GLASS, DO-7, 2 PIN
HERMETICALLY SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code
compliant
unknown
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICAL BONDED
METALLURGICAL BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
15 Ω
JEDEC-95 Code
DO-204AA
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
8.4 V
8.4 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.84 mV/°C
0.84 mV/°C
Voltage Tol-Max
4.76%
4.76%
Working Test Current
10 mA
10 mA
Base Number Matches
2
25
Pbfree Code
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare 1N3154A with alternatives
Compare 1N3154-1 with alternatives