1N3050DUR-1 vs 1N3050 feature comparison

1N3050DUR-1 Microsemi Corporation

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1N3050 Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-13
Package Description HERMETIC SEALED, LEADLESS, GLASS, MELF-2 HERMETIC SEALED, METAL GLASS, DO-13, 2 PIN
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY HIGH RELIABILITY
Case Connection ISOLATED CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 1200 Ω 1200 Ω
JEDEC-95 Code DO-213AB DO-202AA
JESD-30 Code O-LELF-R2 O-MALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS METAL
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 180 V 180 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 1% 20%
Working Test Current 1.4 mA 1.4 mA
Base Number Matches 24 184
Knee Impedance-Max 7000 Ω
Moisture Sensitivity Level 1
Operating Temperature-Min -65 °C
Reverse Current-Max 10 µA
Voltage Temp Coeff-Max 171 mV/°C

Compare 1N3050DUR-1 with alternatives

Compare 1N3050 with alternatives