1N3050CUR-1E3
vs
MV1N3050CUR-1E3TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-213AB
DO-213AB
Package Description
O-LELF-R2
O-LELF-R2
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
1200 Ω
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.25 W
1.25 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
180 V
180 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
1.4 mA
1.4 mA
Base Number Matches
10
1
Operating Temperature-Min
-65 °C
Compare 1N3050CUR-1E3 with alternatives
Compare MV1N3050CUR-1E3TR with alternatives