1N3047AUR-1TR vs 1N3047AUR-1E3 feature comparison

1N3047AUR-1TR Microsemi Corporation

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1N3047AUR-1E3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-213AB
Package Description HERMETIC SEALED, LEADLESS, GLASS, MELF-2 O-LELF-R2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 700 Ω 700 Ω
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 130 V 130 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 10% 10%
Working Test Current 1.9 mA 1.9 mA
Base Number Matches 1 1

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