1N3046DUR-1E3
vs
MV1N3046DUR-1E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-213AB
DO-213AB
Package Description
O-LELF-R2
O-LELF-R2
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Category CO2 Kg
8.7
8.7
EU RoHS Version
RoHS 2 (2011/65/EU)
RoHS 2 (2011/65/EU)
Candidate List Date
2018-06-27
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
550 Ω
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.25 W
1.25 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
120 V
120 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
1%
1%
Working Test Current
2 mA
2 mA
Base Number Matches
1
1
Compliance Temperature Grade
Military: -65C to +175C
Operating Temperature-Min
-65 °C
Compare 1N3046DUR-1E3 with alternatives
Compare MV1N3046DUR-1E3 with alternatives