1N3045B-1
vs
JAN1N3045B-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
COBHAM PLC
Package Description
HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code
compliant
unknown
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
450 Ω
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-XALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
110 V
110 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
2.3 mA
2.3 mA
Base Number Matches
4
8
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare 1N3045B-1 with alternatives