1N3045A
vs
CDLL3045B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
O-MALF-W2
|
HERMETIC SEALED, GLASS, LL41, MELF-2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
450 Ω
|
450 Ω
|
JEDEC-95 Code |
DO-13
|
DO-213AB
|
JESD-30 Code |
O-MALF-W2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Knee Impedance-Max |
4000 Ω
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
METAL
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1 W
|
1 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
110 V
|
110 V
|
Reverse Current-Max |
0.5 µA
|
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WRAP AROUND
|
Terminal Position |
AXIAL
|
END
|
Voltage Tol-Max |
10%
|
5%
|
Working Test Current |
2.3 mA
|
2.3 mA
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
14 Weeks
|
Additional Feature |
|
METALLURGICALLY BONDED
|
|
|
|
Compare 1N3045A with alternatives
Compare CDLL3045B with alternatives