1N3044B-1 vs 1N3044BE3 feature comparison

1N3044B-1 Microchip Technology Inc

Buy Now Datasheet

1N3044BE3 Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-1 O-MALF-W2
Reach Compliance Code compliant unknown
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED HIGH RELIABILITY
Case Connection ISOLATED CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 350 Ω 350 Ω
JEDEC-95 Code DO-41 DO-202AA
JESD-30 Code O-LALF-W2 O-MALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS METAL
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 100 V 100 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 2.5 mA 2.5 mA
Base Number Matches 4 1
Part Package Code DO-13
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Operating Temperature-Min -65 °C

Compare 1N3044B-1 with alternatives

Compare 1N3044BE3 with alternatives