1N3042B-1E3 vs MSP1N4762AG feature comparison

1N3042B-1E3 Microsemi Corporation

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MSP1N4762AG Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LALF-W2 O-LALF-W2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 200 Ω
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Reference Voltage-Nom 82 V 82 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish PURE MATTE TIN TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3 mA 3 mA
Base Number Matches 1 1
Pbfree Code No
Part Package Code DO-204
Pin Count 2
JESD-609 Code e0
Operating Temperature-Min -65 °C
Reference Standard MIL-19500

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