1N3042B-1E3
vs
MSP1N4762AG
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
O-LALF-W2
O-LALF-W2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
200 Ω
JEDEC-95 Code
DO-41
DO-204AL
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Voltage-Nom
82 V
82 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
PURE MATTE TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3 mA
3 mA
Base Number Matches
1
1
Pbfree Code
No
Part Package Code
DO-204
Pin Count
2
JESD-609 Code
e0
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare 1N3042B-1E3 with alternatives
Compare MSP1N4762AG with alternatives