1N3042B-1 vs 1N3042BTRE3 feature comparison

1N3042B-1 Microsemi Corporation

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1N3042BTRE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code unknown unknown
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 200 Ω 200 Ω
JEDEC-95 Code DO-41 DO-202AA
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -55 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified
Reference Voltage-Nom 82 V 82 V
Surface Mount NO NO
Technology ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3 mA 3 mA
Base Number Matches 4 1
ECCN Code EAR99
HTS Code 8541.10.00.50

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