1N3041B-1E3 vs 1N3041B feature comparison

1N3041B-1E3 Microsemi Corporation

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1N3041B Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Package Description HERMETIC SEALED, GLASS PACKAGE-1 O-MALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 175 Ω 175 Ω
JEDEC-95 Code DO-41 DO-13
JESD-30 Code O-LALF-W2 O-MALF-W2
JESD-609 Code e3 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS METAL
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Reference Voltage-Nom 75 V 75 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3.3 mA 3.3 mA
Base Number Matches 2 10
Knee Impedance-Max 2000 Ω
Operating Temperature-Min -65 °C
Qualification Status Not Qualified
Reverse Current-Max 0.5 µA

Compare 1N3041B-1E3 with alternatives

Compare 1N3041B with alternatives